Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling
Liu, Yong · Springer US
MLA
Liu, Yong. Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling. Springer US.
APA
Liu, Yong. (n.d.). Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling. Springer US.
Chicago
Liu, Yong. Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling. Springer US, n.d.
Wikipedia
{{cite book |title=Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling |author1=Liu, Yong |publisher=Springer US |location=Boston, MA |language=en |isbn=9781461410539}}
BibTeX
@book{isbn9781461410539, title = {Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling}, author = {{Liu, Yong}}, publisher = {Springer US}, address = {Boston, MA}, language = {eng}, isbn = {9781461410539}, }
Before you use it
JSON API: one request returns all five styles, normalized ISBN identity, and available quality and uncertainty fields. A 200 {found:false} response ends the immediate lookup attempt. Temporary failures carry retry guidance.
Cookie-free aggregate counts of client-reported copy, download initiation and JSON-link activation help us understand usefulness. Browser privacy opt-outs are honored.